Thermosetting resin composition and a semiconductor device

Abstract

The object of the present invention is to provide a thermosetting resin composition with excellent adhesion to metals. A thermosetting resin composition comprises: (A) a thermosetting resin; (B) a silane coupling agent represented by formula (I) below; (in formula (I), R1 is independently an alkyl group having 1 to 8 carbon atoms, m is an integer of 1 to 3, n is an integer of 0 to 10, Q is a single bond or amide bond (-NHCO-), and A is a group containing a nitrogen-containing heterocycle comprising at least two nitrogen atoms, one of which is bonded to a carbon atom of -(CH2)n- or -NHCO-); (C) a curing accelerator; and (D) an inorganic filler.