Insulating resin with improved elongation, build up film and printed circuit board using the same

TW202633996APending Publication Date: 2026-08-16HANWHA E-SSENTIAL CORP

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Patent Information

Application Number: TW115104363
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2025-02-04
Filing Date: 2026-02-04
Publication Date: 2026-08-16

Application Information

Patent Timeline

04 Feb 2025

Priority

04 Feb 2026

Application

TW115104363

16 Aug 2026

Publication

TW202633996A

IPC: C08L63/00; B32B27/38; C08K3/013; C08K9/06; H05K1/03

Inventors: 金大虎; 李海東

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Abstract

This invention relates to an insulating resin with excellent ductility and a multilayer film or insulating layer prepared therefrom. The insulating resin, as a circuit material, has both a low coefficient of thermal expansion and low dielectric loss for realizing microcircuits, and excellent adhesion to copper plating. The insulating film or insulating layer is suitable for use as a multilayer film for printed circuit boards.

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