Thermally conductive polysiloxane composition and its manufacturing method

Abstract

A thermally conductive polysiloxane composition comprises a matrix resin component and thermally conductive inorganic particles. The matrix resin component comprises: (A) a non-reactive liquid dimethylpolysiloxane with a kinematic viscosity of 100–10,000 mm² / s at 25°C, and (B) a pre-crosslinked polysiloxane gel crosslinker. Relative to 100% by mass of the matrix resin component, the non-reactive liquid dimethylpolysiloxane (A) comprises 40–97% by mass, the polysiloxane gel crosslinker (B) comprises 3–60% by mass, and the thermally conductive inorganic particles comprise 81–97% by mass relative to 100% by mass of the composition. This provides a thermally conductive polysiloxane composition and its manufacturing method that ensures that "even with thermal shocks to semiconductor devices, the composition will not shift from the mounting portion and can sufficiently maintain thermal conductivity." none

Images