Curable thermally conductive silicone composition

TW202634009APending Publication Date: 2026-08-16DOW SILICONES CORP

View PDF 0 Cites 0 Cited by

Patent Information

Application Number: TW114134289
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2024-10-10
Filing Date: 2025-09-08
Publication Date: 2026-08-16

Application Information

Patent Timeline

10 Oct 2024

Priority

08 Sep 2025

Application

TW114134289

16 Aug 2026

Publication

TW202634009A

IPC: C08L83/07; C08K3/013; C08K3/22; C08K7/18; C08L83/04; C08L83/05

Inventors: 蔣奇; 李嫣然

Get more patent work done with AI

Run novelty searches—or use them for FTO, design risk, drafting and technical problem-solving.

Explore More Agents

Novelty Search
Search existing technologies and assess novelty
↗
FTO
Analyze whether a product may infringe others' patents
↗
Design FTO
Check prior-design risk for exterior design
↗
Drafting
Draft patent application text based on a technical solution
↗
Find Solutions with TRIZ
Generate feasible solution to solve your technical challenge
↗
IP MCP Servers
Connect trusted patent search and cited evidence to Claude, Cursor or your own AI workflow
↗

Patent Text Reader

Abstract

A curable thermally conductive composition comprises: (A) an alkenyl-functional organopolysiloxane having an average of at least two alkenyl groups per molecule; (B1) an organopolysiloxane containing an alkoxysilyl group; (C) a thermally conductive filler mixture comprising, based on the curable thermally conductive composition weight, (C1)

Need to check novelty before this filing date? Find Prior Art