Thermally softening and thermally conductive silicon oxide compositions and thermally softening and thermally conductive silicon oxide curings

Abstract

This invention relates to a thermally softening and thermally conductive silica composition, characterized by comprising the following components (A) to (E): (A) a phenyl-modified organopolysiloxane; (B) an organohydrogen-modified polysiloxane; (C) one or more selected from the group consisting of organopolysiloxanes having hydrolyzable functional groups and alkoxysilane compounds represented by the following general formula (2); (D) one or more selected from the group consisting of gallium and gallium alloys with a melting point of 0 to 70°C; and (E) a platinum group metal catalyst. This results in excellent thermal softening, secondary processability, and compressibility, thereby achieving low thermal resistance. none