Particles, components, shaped bodies and low-dielectric materials
TW202634015APending Publication Date: 2026-08-16DAIKIN INDUSTRIES LTD +1
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Patent Information
- Application Number
- TW114146745
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-09-11
- Filing Date
- 2025-11-28
- Publication Date
- 2026-08-16
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Figure TWG2TA001073106_001 
Figure TWG2TA001073106_002
Abstract
This invention provides particles, compositions, molded articles, and low-dielectric materials that enable the microdispersion of fluororesins in a matrix resin. The particles of this invention comprise a fluororesin, a compound (I) having a plurality of groups (A) represented by the following formula, and a compound (II) capable of reacting with the above compound (I) (where R1 and R2 are the same or different, are hydrogen or organic groups, and can bond together to form a ring structure; the double lines represented by solid and dashed lines are single or double bonds). none
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