Silicon wafer processing methods and apparatus

Abstract

This invention discloses a silicon wafer processing method and apparatus. In one aspect, a silicon wafer processing method is provided for use in double-sided polishing of silicon wafers. The method includes, during the double-sided polishing process, real-time monitoring of the pressure applied to the silicon wafer and the rotational speed of the polishing pad polishing the silicon wafer; classifying the pressure into one of a preset plurality of pressure ranges and the rotational speed into one of a preset plurality of speed ranges; and providing a polishing fluid with a corresponding formulation in the double-sided polishing process according to the classified pressure range and the classified speed range.

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