Colloidal silica and chemical mechanical polishing composition comprising the same
TW202634019APending Publication Date: 2026-08-16ENF TECH CO LTD +1
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Patent Information
- Application Number
- TW114151524
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-12-24
- Filing Date
- 2025-12-26
- Publication Date
- 2026-08-16
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Figure TWG2TA001073322_001 
Figure TWG2TA001073322_002 
Figure TWG2TA001073322_003
Abstract
The present disclosure relates to colloidal silica useful as abrasive particles, and more particularly, the colloidal silica has a first peak at 533±0.5eV and a second peak at 534±0.5eV in an X-ray photoelectron spectroscopy (XPS) spectrum measured by XPS, an intensity of the first peak is greater than an intensity of the second peak, and in a small-angle X-ray scattering (SAXS) spectrum, a surface fractal parameter (p) at a scattering vector (q) of
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