Polishing compositions and methods of use thereof
TW202634020APending Publication Date: 2026-08-16FUJIFILM ELECTRONIC MATERIALS U S A INC
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW115104644
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-10
- Filing Date
- 2026-02-05
- Publication Date
- 2026-08-16
Abstract
This disclosure relates to a method that includes applying a polishing composition to a substrate including elemental silicon on a surface of the substrate; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate. The polishing composition includes
Need to check novelty before this filing date? Find Prior Art