Thermosetting epoxy-silicone mixed resin composition for white reflectors and semiconductor devices

Abstract

The object of the present invention is to provide a resin composition that imparts excellent bending characteristics at room temperature, excellent initial reflectivity, excellent heat resistance, low light transmittance, and excellent adhesion to substrates plated with metals such as gold and silver. The solution is a thermosetting epoxy-silicone mixed resin composition for white reflectors, comprising: (A) a prepolymer of the reaction products of (A-1), (A-2), and (A-3) below; (A-1) an organopolysiloxane having at least a D unit containing an aliphatic epoxy group and a T unit containing an aromatic hydrocarbon group; (A-2) a specific epoxy resin; (A-3) an anhydride-based curing agent; (B) zinc cyanurate; (C) a white pigment; (D) an inorganic filler; (E) a curing catalyst; and (F) an antioxidant.