Methods for temporarily fixing the substrate layer, laminates, and methods for recycling the substrate layer.

Abstract

A method for temporarily fixing a substrate layer to a support having a hardened resin layer (A) directly formed on its surface, the method comprising: a lamination step of arranging the substrate layer on the hardened resin layer (A) formed on the support in such a way as to clamp a composition containing a predetermined monomer (b); and a curing step of curing the composition containing the monomer (b) to form a hardened resin layer (B) and temporarily fixing the substrate layer to the support.

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