Slurry, multi-liquid slurry, grinding method, manufacturing method of parts and manufacturing method of semiconductor parts

Abstract

A slurry containing abrasive particles including cerium-based particles and an organic amine compound. A plurality of liquid slurry, wherein the components of the aforementioned slurry are stored in at least a first liquid and a second liquid, the first liquid containing the aforementioned abrasive particles, and the second liquid containing the aforementioned organic amine compound. A polishing method comprising the step of polishing a workpiece using the aforementioned slurry. A method for manufacturing a part comprising the step of obtaining a part using a workpiece polished by the aforementioned polishing method. A method for manufacturing a semiconductor part comprising the step of obtaining a semiconductor part using a workpiece polished by the aforementioned polishing method.