Two phase shower immersion cooling system for data center
TW202634041APending Publication Date: 2026-08-16美商振宇研創
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Patent Information
- Application Number
- TW114147930
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-12-04
- Filing Date
- 2025-12-08
- Publication Date
- 2026-08-16
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Figure TWG2TA001073173_001 
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Figure TWG2TA001073173_003
Abstract
A cooling system, including a coolant chamber; wherein a plurality of circuit boards is vertically disposed in the coolant chamber, and the liquid coolant is vaporized as coolant vapor via absorbing a heat generated by a heat generating component on a circuit board; wherein the liquid coolant is injected into the coolant chamber from a top of the coolant chamber during an operation of the cooling system; wherein the liquid coolant flows downward and through the plurality of circuit boards; wherein a heating surface associated with the heat generating component is in contact with the liquid coolant; wherein a space between the plurality of circuit boards is filled with a mixture of air and coolant vapor.
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