Substrate processing method and substrate processing system

Abstract

[Problem] To accurately estimate the composition concentration of the etching solution when etching the surface of a substrate. [Solution] The present invention is a substrate processing method for processing a substrate, comprising the following steps: etching the surface of the substrate using a plurality of reference etching solutions with different composition concentrations, and deriving a reference etching amount distribution on the surface of the etched substrate, and memorizing the plurality of reference etching solutions and the plurality of reference etching amount distributions in correspondence; etching the surface of the substrate using a target etching solution with an estimated composition concentration, and deriving a target etching amount distribution on the surface of the etched substrate; and comparing the target etching amount distribution with the plurality of reference etching amount distributions to estimate the composition concentration of the target etching solution.

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