Copper materials and insulating substrates
TW202634080APending Publication Date: 2026-08-16MITSUBISHI MATERIALS CORP
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Patent Information
- Application Number
- TW114142395
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-01
- Filing Date
- 2025-10-31
- Publication Date
- 2026-08-16
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Figure TWG2TA001072884_001 
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Abstract
The Cu content is set to be 99.9% or higher, the conductivity to be 95% IACS or higher, and in a cross-section orthogonal to the plate thickness direction, when the crystal orientation distribution function obtained by texture analysis by EBSD is expressed in Euler angles (φ1, Φ, φ2), the average value of the orientation density is 3.0 or higher in φ1: 30~45°, Φ: 40~50°, and φ2: 0°, and the average value of the orientation density is 1.4 or lower in φ1: 20~35°, Φ: 90°, and φ2: 45°.
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