Copper alloy materials, as well as resistor materials, resistors, heating element materials, and heating elements using copper alloy materials.

Abstract

This invention provides a copper alloy material and a resistor material, resistor, heating element material, and heating element using the copper alloy material. The copper alloy material has a volume resistivity ρ within a desired range, and a small absolute value of its temperature coefficient of resistance (TCR) over a wide temperature range from room temperature (e.g., 20°C) to high temperature (e.g., 150°C), and exhibits minimal resistance change when placed at temperatures higher than the operating environment (e.g., 200°C). The copper alloy material of this invention has the following alloy composition: containing Mn: 9.0% by mass or more and 13.0% by mass or less, Ni: more than 4.0% by mass or less and 6.0% by mass or less, and Co: 0.25% by mass or more and 2.0% by mass or less, with the remainder consisting of Cu and unavoidable impurities.