Copper alloys and electronic components
TW202634083APending Publication Date: 2026-08-16JX NIPPON MINING & METALS CORP
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114123485
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-16
- Filing Date
- 2025-06-23
- Publication Date
- 2026-08-16
Smart Images
Figure 00000000_0000_ABST
Abstract
This disclosure provides a copper alloy with improved bending formability. The copper alloy disclosed contains 0.50 to 3.0% by mass of Co, 0.10 to 1.0% by mass of Si, with the remainder consisting of Cu and unavoidable impurities, and has an elongation at break of 5% or more and a work hardening coefficient of 0.0175 or more. none
Need to check novelty before this filing date? Find Prior Art