Process chamber with in-situ magnetic annealing and bow control, and semiconductor processing system and method of processing a semiconductor using the same

TW202634093APending Publication Date: 2026-08-16APPLIED MATERIALS INC
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Patent Information

Application Number
TW114138568
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-23
Filing Date
2025-10-07
Publication Date
2026-08-16

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    Figure TWG2TA001072701_003
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Abstract

A process chamber for fabricating a semiconductor is disclosed. In one aspect, the process chamber includes a chamber body defining a chamber volume. The process chamber also includes a pedestal having a heater arranged to heat a substrate disposed on the pedestal. The pedestal is movable within the chamber volume between a first position and a second position. When the pedestal is in the first position, the pedestal at least partially defines a process cavity in which the substrate is processed. The process chamber further includes a magnet coupled with the chamber body below the process cavity. With the pedestal in the second position and the heater heating the substrate, the magnet is arranged to expose the substrate to a magnetic field in-situ within the chamber volume.
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