Integrated substrate processing apparatus and method

Abstract

This invention provides an integrated substrate processing apparatus (100) comprising a substrate module integrated under vacuum via a wafer processing module (150). The substrate module includes: a first substrate processing module (110) having a remote plasma generator (115) configured to process one substrate (101) at a time in a plasma enhancement process; and a second substrate processing module (120) capable of processing at least one batch of substrates (101) in a thermal mode for thin film deposition, the second substrate processing module (120) including a heated substrate support (215). An integrated substrate processing apparatus (100) consists of substrate modules integrated, under vacuum, via a wafer handling module (150). The processing module (120) consists of a heated substrate support (215).

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