Methods for manufacturing conductive particles

TW202634121APending Publication Date: 2026-08-16NIPPON CHEMICAL IND CO LTD
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Patent Information

Application Number
TW114136609
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-09-27
Filing Date
2025-09-23
Publication Date
2026-08-16

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Abstract

The purpose of this invention is to provide conductive particles with excellent connection resistance and reliability by forming a uniform noble metal layer on the surface of a nickel film without leaving any impurities in the surface-treated nickel film. This invention is a method for manufacturing conductive particles, comprising: an acid treatment step, in which nickel-coated particles with a nickel or nickel alloy film formed on the surface of core particles are contacted with an aqueous organic acid solution; and a plating step, in which the acid-treated nickel-coated particles are electroless plated with a noble metal. Formic acid and acetic acid, among others, can be used as the organic acid.
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