Laminated structure

TW202634123APending Publication Date: 2026-08-16OKUNO CHEM IND CO LTD
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Patent Information

Application Number
TW114137303
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-06-06
Filing Date
2025-09-26
Publication Date
2026-08-16

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    Figure TWG2TA001072644_003
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Abstract

Object An object of the present invention is to provide a laminated structure including a plating film and an intermediate film, the laminated structure having good adhesion and further having good insulating properties, throwing power, etching resistance, wiring formability, migration resistance, or seed layer removability. Solution Provided is a laminated structure in which a plating film is formed on a substrate, the laminated structure including, between the substrate and the plating film, an intermediate film made of a metal oxide and having a surface resistivity of
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