Etching solution composition

TW202634124APending Publication Date: 2026-08-16KAO CORP

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Patent Information

Application Number: TW114139026
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2025-10-08
Filing Date: 2025-10-09
Publication Date: 2026-08-16

Application Information

Patent Timeline

08 Oct 2025

Priority

09 Oct 2025

Application

TW114139026

16 Aug 2026

Publication

TW202634124A

IPC: C23F1/26; H10P50/66

Inventors: 笹原久武; 内田洋平

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Abstract

In one embodiment, the present invention provides an etching solution composition that improves the uniformity of etching components containing nitrides of titanium-based metals, tungsten-based metals, titanium-tungsten-based metals, or the like. In another embodiment, the present invention relates to an etching solution composition for etching components containing nitrides of titanium-based metals, tungsten-based metals, titanium-tungsten-based metals, or the like, and comprises the following components A, B, and D, with a mass ratio of A / D of 1 to 4. Component A: Phosphoric acid; Component B: Nitric acid; Component D: Aprotic polar solvent.

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