Electroplating equipment

Abstract

This application provides an electroplating apparatus, comprising: an electroplating chamber for containing an electroplating solution; an anode located inside the electroplating chamber; a substrate holding device for holding a substrate and immersing the plating surface of the substrate in the electroplating solution during electroplating; and a substrate extension assembly including an extension chamber, an extension cathode, and a diaphragm, wherein the extension cathode is located inside the extension chamber and biased by the cathode, and the diaphragm isolates the extension cathode from the electroplating chamber; wherein the extension chamber has a drain portion facing the anode, the drain portion having an opening, and during electroplating, the drain portion is located below the substrate, surrounding the radially outer side of the substrate and parallel to the plating surface of the substrate, for allowing current from the anode to partially flow through the drain portion to the extension cathode, so that the drain portion forms an extension plating surface on the radially outer side of the substrate. The electroplating apparatus of this application effectively suppresses or even eliminates the negative impact of edge effects on the substrate.

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