High power cooling device

Abstract

A high power cooling device is configured to be in thermal contact with a heat source, and includes a thermal conductive cavity and an isolation body. The thermal conductive cavity has a heat absorption surface, a first chamber and a second chamber. The first chamber is closer to the heat absorption surface than the second chamber. The isolation body is disposed in the first chamber of the thermal conductive cavity, and divides the first chamber into a main thermal zone and a primary thermal zone which are not in fluid communication with each other. The main thermal zone is surrounded by the isolation body, and is in fluid communication with the second chamber.

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