Equipment for predicting wafer deformation
TW202634215APending Publication Date: 2026-08-16SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Application Number
- TW114130558
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-04
- Filing Date
- 2025-08-11
- Publication Date
- 2026-08-16
Smart Images
Figure TWG2TA001072547_001 
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Figure TWG2TA001072547_003
Abstract
An equipment for predicting wafer deformation includes a transport unit that transports a wafer; a sensor unit that recognizes a plurality of edge points of the wafer being transported by the transport unit; and a control unit that projects positions of the plurality of edge points of the wafer recognized by the sensor unit onto a coordinate plane, and predicts a plane form of the wafer based on the positions of the plurality of edge points of the wafer projected onto the coordinate plane.
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