Wafer Shape Measurement System and Wafer Shape Measurement Method

TW202634217APending Publication Date: 2026-08-16AUROS TECH INC
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Patent Information

Application Number
TW114148839
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-07-23
Filing Date
2025-12-12
Publication Date
2026-08-16

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Abstract

A wafer three-dimensional shape measurement system and method are disclosed. Unlike prior art, this invention uses a continuous phase generation unit to rapidly convert a wound phase map into a continuous phase map using an applicable compensation algorithm. Furthermore, the wafer shape is calculated using this continuous phase map. Therefore, this invention can calculate the wafer shape quickly and accurately.
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