Surface pressure analysis apparatus, method and recording medium

TW202634227APending Publication Date: 2026-08-16FUJIFILM CORP
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Patent Information

Application Number
TW115116970
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2020-05-22
Filing Date
2021-05-20
Publication Date
2026-08-16

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Abstract

A surface pressure analysis device is provided that can automatically evaluate the surface pressure applied to the inspection surface of an object to be measured. An image acquisition unit, which functions as a server in the surface pressure analysis device, acquires inspection images from a user terminal. The inspection image is a photographic image of a pressure measuring film disposed on the inspection surface of the object to be measured, and colored with a concentration distribution corresponding to the intensity of the pressure applied to the inspection surface. A conversion unit converts the concentration values ​​of the inspection image into a first pressure value distributed in two dimensions. An evaluation information generation and processing unit compares the first pressure value with a limit sample read from memory, generating information (evaluation information) indicating the degree of consistency between the two as a first determination result. The first determination result is output from an output unit to the user terminal and displayed on the user terminal's screen.
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