Raman detecting chip

Abstract

A Raman detecting chip includes a carrier and a metal structure arranged on the carrier, wherein the metal structure includes a structured substrate, a metal layer and metal particles. Grooves are formed on the upper surface of the structured substrate and arranged in an array along the X direction and the Y direction. The metal layer is arranged on the rectangular bottom surface and four inclined walls of the groove. The metal particles are all over the metal layer. The bottom edges of the four inclined walls are respectively connected to the four edges of the rectangular bottom surface. In the grooves arranged along the X direction, the top edge of the inclined wall of the groove is connected to the top edge of the inclined wall of the adjacent groove. In the grooves arranged along the Y direction, the top edge of the inclined wall of the groove is connected to the top edge of the inclined wall of the adjacent groove. The Raman detecting chip has the advantages that the structure type and size of the structured substrate may be controlled and the Raman signal enhancement effect is consistent.

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