Multi-layer alignment system and method
TW202634248APending Publication Date: 2026-08-16TOKYO ELECTRON LTD
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Patent Information
- Application Number
- TW114138979
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-07
- Filing Date
- 2025-10-09
- Publication Date
- 2026-08-16
Smart Images
Figure TWG2TA001072729_001 
Figure TWG2TA001072729_002 
Figure TWG2TA001072729_003
Abstract
A semiconductor structure includes a first layer, a second layer, and a third layer bonded together in a multi-layer stack. The first layer includes a first alignment section, the second layer includes a second alignment section, and the third layer includes a third alignment section and a fourth alignment section. The third alignment section is along a first X-ray path with the first alignment section and the fourth alignment section is along a second X-ray path with the second alignment section.
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