Test system with temperature monitoring

Abstract

A test system for testing a device under test integrated on a semiconductor wafer is herein disclosed, the system comprising at least one test element configured to monitor a temperature of the device under test or of the semiconductor wafer and at least one support. The test element comprises a first branch including a first portion made of a first conductive material, and a second branch including a second portion made of a second conductive material that is different from the first conductive material, the second portion being connected to the first portion at a junction region, wherein the junction region comprises a contact end, wherein the first branch and the second branch form at least part of a circuit adapted to be subjected to a temperature difference between the contact end of the junction region, which during the test is located at the device under test or at the semiconductor wafer, and a reference which is at a reference temperature, and wherein said first conductive material and said second conductive material are selected to cause a potential difference proportional to the temperature difference to be generated in the circuit.

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