Test device and its pogo pin device

Abstract

A pogo pin device provided includes a probe body, a compression spring and a plunger. The probe body is provided with a tubular channel therein. The compression spring is received within the tubular channel. The plunger includes a plunger body, a probe tip, an inclined surface and a scraping portion. The plunger body is slidably inserted into one end of the probe body to abut against the compression spring in the probe body. The probe tip is located at another end of the plunger body opposite to the compression spring. The inclined surface is connected to the probe tip and a lateral side of the plunger body, respectively. The scraping portion includes a plurality of parallel sawtoothed rows arranged on the inclined surface, and each of the sawtoothed row is arranged along a long axis direction of the inclined surface.

Description

[Technical Field]

[0001] The present invention relates to a telescopic probe device, and more particularly to a telescopic probe device capable of improving solder dross residue and a testing device having the telescopic probe device. [Previous Technology]

[0002] Generally speaking, when a probe card conducts electrical tests on a device under test (e.g., a semiconductor packaged wafer, hereinafter referred to as DUT), several probes of the probe card press together on the device under test to conduct electrical tests on the device under test.

[0003] However, some residues (such as solder balls or solder dross) tend to accumulate at the tip of the probe, which need to be scraped or cleaned frequently. Otherwise, if too much residue accumulates, it will increase the resistance value of the probe and reduce the conductivity of the probe, thereby affecting the test results of the probe card.

[0004] It is evident that the aforementioned technology still has inconveniences and shortcomings, and needs further improvement. Therefore, how to effectively solve the aforementioned inconveniences and shortcomings is indeed one of the important research and development topics at present, and has also become a target that urgently needs to be improved in the relevant fields. [Summary of the Invention]

[0005] One object of the present invention is to provide a testing device and a telescopic probe device thereof to solve the difficulties mentioned above in the prior art.

[0006] One embodiment of the present invention provides a telescopic probe device. The telescopic probe device includes a needle body, a compression spring, and a first plunger. The needle body has a cylindrical channel. The compression spring is housed within the cylindrical channel. The first plunger includes a column, a needle tip, an inclined surface, and a scraping portion. The column is slidably inserted into one end of the needle body and abuts against the compression spring within the cylindrical channel. The needle tip is located at the end of the column opposite to the compression spring. The inclined surface connects the needle tip and the outer surface of the column. The scraping portion includes a plurality of parallel rows of serrations arranged on the inclined surface, and each row of serrations is configured along the long axis of the inclined surface.

[0007] One embodiment of the present invention provides a testing device. The testing device includes a pressing member, a circuit board, a probe holder, and the aforementioned telescopic probe device. The pressing member is movable vertically. The circuit board is located below the pressing member and includes at least one electrical contact. The probe holder includes a body and a slot. The body is placed on the circuit board, and the slot is recessed in the top surface of the body for placing an electronic component. The electronic component includes a package and at least one pin. The pin includes a front section, a rear section, and a connecting section. The front section extends from one side of the package and is at a different height from the rear section. The connecting section connects the front section and the rear section and forms a lower arc surface with the rear section. The telescopic probe device is inserted into the bottom of the slot, electrically connected to the electrical contact, and is positioned on the lower arc surface of the pin of the electronic component, vertically aligned with it. Thus, when the pressing member presses the electronic component in the slot, the scraping part of the telescopic probe device presses against and slides through the lower arc surface of the pin.

[0008] Thus, through the above architecture, the telescopic probe device of the test apparatus of the present invention can slide and scrape the arc surface under the corresponding pin of the electronic component during each test, providing a self-cleaning function (i.e., automatically removing solder dross), thereby reducing the resistance value of the probe, improving the conductivity of the probe, and the test results of the probe card.

[0009] The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced, etc. The specific details of the present invention will be described in detail in the following embodiments and related figures.

Implementation Method

[0010] Several embodiments of the present invention will be described below with reference to the drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, these practical details are not essential in the various embodiments of the present invention. In addition, for the sake of simplicity, some conventional structures and elements will be shown in the drawings in a simple schematic manner.

[0011] Figure 1A is a perspective view of a telescopic probe device 10 according to an embodiment of the present invention. Figure 1B is a longitudinal sectional view of the telescopic probe device 10 in Figure 1A along the vertical direction. Figure 2 is a regional schematic diagram of Figure 1A. Figure 3 is a sectional view of Figure 2 along line segment AA.

[0012] As shown in Figures 1A to 3, in this embodiment, the telescopic probe device 10 includes a needle body 100, a compression spring 110, a first plunger 120, and a second plunger 190. The needle body 100 is a straight tube and includes a first end 101, a second end 102, and a cylindrical channel 103. The first end 101 and the second end 102 are opposite to each other. The cylindrical channel 103 is formed inside the needle body 100, coaxial with the needle body 100, and connects the first end 101 and the second end 102 respectively. The compression spring 110 is confined within the cylindrical channel 103. The first plunger 120 is slidably inserted into the first end 101 of the needle body 100 and abuts against the compression spring 110 within the cylindrical channel 103, so that the first plunger 120 is elastic after being compressed on the needle body 100. The second plunger 190 is slidably inserted into the second end 102 of the syringe body 100 and abuts against the compression spring 110 in the columnar channel 103, so that the second plunger 190 can rebound after being compressed on the syringe body 100.

[0013] More specifically, the first plunger 120 includes a column 130, a needle tip 140, an inclined surface 150, and a scraping portion 160. The column 130 is straight and is slidably inserted into the first end 101 of the needle tube body 100. One end of the column 130 abuts against a compression spring 110 within the columnar channel 103, and the needle tip 140 is located at the other end of the column 130 (i.e., relative to the end of the compression spring 110). More specifically, the column 130 includes two opposing first outer surfaces 131 and two opposing second outer surfaces 132. Each first outer surface 131 is connected to the inclined surface 150, the needle tip 140, and the second outer surface 132, respectively. The inclined surface 150 is inclined relative to the column 130, and the major axis 153 of the inclined surface 150 forms an angle θ with the major axis 153 (e.g., the Z-axis) of the needle body 100 (i.e., the column 130). The angle θ is, for example, 135° to 145°. The inclined surface 150 is rectangular, and its two opposite ends are respectively connected to the needle tip 140 and one of the second outer surfaces 132 (i.e., the shorter second outer surface 132) of the column 130. The scraping part 160 includes a plurality of (e.g., 2 to 3) parallel rows of serrations 170, and each row of serrations 170 is arranged along the major axis 153 of the inclined surface 150. A row of solder channels 173 is separated between any two adjacent rows of serrations 170. These rows of serrations 170 are arranged on the inclined surface 150. These serrations 170 are spaced apart from the first outer surface 131 and the second outer surface 132, and each serration 170 is spaced apart from the corresponding first outer surface 131.

[0014] In this embodiment, each sawtooth row 170 includes a plurality of pointed teeth 172. These pointed teeth 172 of each sawtooth row 170 are arranged in a single row along the major axis direction 153 of the inclined surface 150, and these pointed teeth 172 are separated from each other and spaced apart along the major axis direction 153 of the inclined surface 150. The tip of each pointed tooth 172 extends toward the normal direction L of the inclined surface 150.

[0015] In this embodiment, the inclined surface 150 is further divided into an upper inclined surface area 151, a middle section area 154, and a lower inclined surface area 152. The middle section area 154 is located between the upper inclined surface area 151 and the lower inclined surface area 152, and the scraping part 160 (i.e., the serrated row 170) is located only within the middle section area 154. The upper inclined surface area 151 connects the middle section area 154 and the needle tip 140, respectively, and the lower inclined surface area 152 connects the middle section area 154 and the shorter second outer surface 132 of the column 130, respectively.

[0016] Furthermore, the column 130 also has groove structures 180, which are formed on the outer surface of the column 130. For example, two groove structures 180 are formed on the first outer surface 131 of the column 130. However, the invention is not limited thereto. In other embodiments, the inclined surface 150 may also be triangular; the major axis directions (referring to the major axis direction 153) of these rows of serrations 170 may also intersect each other; the pointed teeth 172 may also be directly connected to each other along the major axis direction 153 of the inclined surface 150; each row of serrations 170 may also be directly connected to the corresponding first outer surface 131 and these second outer surfaces 132; and / or the tip of each pointed tooth 172 may also extend toward the major axis direction (such as the Z-axis) of the column 130.

[0017] Figure 4 is a partial cross-sectional view of the first plunger 121 according to an embodiment of the present invention, and its cross-sectional direction is the same as that of Figure 3. The first plunger 121 in Figure 4 is substantially the same as the first plunger 120 in Figure 3, except that, as shown in Figure 4, each serration 171 is stepped, and the pointed teeth 174 of each serration 171 are directly connected in sequence. More specifically, each pointed tooth 174 includes a first stepped surface 174A and a second stepped surface 174B. The first stepped surface 174A and the second stepped surface 174B are connected to each other and orthogonal to each other, and the first stepped surface 174A is parallel to the major axis direction (such as the Z-axis) of the cylinder 130 (i.e., the needle body 100). The first stepped surface 174A of each pointed tooth 174 is connected to the second stepped surface 174B of the adjacent pointed tooth 174, and similarly, the second stepped surface 174B is adjacent to the first stepped surface 174A of the pointed tooth 174. It should be understood that since the pointed teeth 174 of the serrated row 171 are directly connected as one piece, it can provide stronger structural strength and also prevent foreign objects from remaining between the pointed teeth 174.

[0018] Figure 5 is an exploded view of a test apparatus 200 according to an embodiment of the present invention. Figure 6 is an operational diagram of the telescopic probe device 11 in Figure 5 for use with the pin 320 of an electronic component 300. As shown in Figures 5 and 6, a test apparatus 200 is suitable for performing electrical tests on an electronic component 300, and the test apparatus 200 includes a pressing member 210, a circuit board 220, a probe holder 230, and a plurality of telescopic probe devices 11. The pressing member 210 is movable vertically. The circuit board 220 is located below the pressing member 210 and includes a plate body 221 and a plurality of electrical contacts 222. These electrical contacts 222 are spaced apart on one surface of the plate body 221. The probe holder 230 includes a plate body 231 and a slot 232. The plate body 231 is located between the pressing member 210 and the circuit board 220 and is placed on the circuit board 220. Slots 232 are recessed into the top surface 231T of the base 231 for housing the electronic component 300. These telescopic probe devices 11 are spaced apart within the slots 232; that is, in this embodiment, each telescopic probe device 11 is vertically inserted into one of the probe holes 233 in the bottom 232A of the slot 232, electrically connecting one of its electrical contacts 222 to one of the pins 320 of the electronic component 300, thereby allowing electrical connection between the electronic component 300 and the circuit board 220. These telescopic probe devices 11 of the testing device 200 can be the same as those in the aforementioned embodiments.

[0019] In this embodiment, for example, the electronic component 300 includes a package 310 and a plurality of pins 320. The package 310 has a rectangular outline, and the pins 320 are arranged at intervals on each side (e.g., four sides) of the package 310, such that the pins 320 of the electronic component 300 extend from the package 310 respectively.

[0020] More specifically, the pins 320 of each electronic component 300 are Z-shaped, including a front section 321, a rear section 323, and a connecting section 322. The front section 321 extends from one side of the package 310 and is at a different height from the rear section 323. The connecting section 322 connects the front section 321 and the rear section 323, and has an upper arc surface 324 between it and the front section 321, and a lower arc surface 325 between it and the rear section 323. The lower arc surface 325 has a high curvature (e.g., R < 0.2 mm).

[0021] In this embodiment, these telescopic probe devices 11 are specifically designed and configured within the slot 232 such that each telescopic probe device 11 is precisely aligned perpendicularly along the Z-axis with the lower arc surface 325 of one of the pins 320 of the electronic component 300, not its rear portion 323. In other words, the orthographic projection of the lower arc surface 325 of one of the pins 320 of the electronic component 300 to the corresponding telescopic probe device 11 is precisely located on the inclined surface 150 (i.e., the scraping portion 160). Therefore, when the electronic component 300 is placed in the slot 232, the scraping portion 160 of each telescopic probe device 11 can precisely contact the lower arc surface 325 of the corresponding pin 320.

[0022] Thus, when the lowering member 210 presses the electronic component 300 in the slot 232, the scraping part 160 of the telescopic probe device 11 can slide along the arc contour of the lower arc surface 325 of the pin 320, thereby having a self-cleaning function that can automatically remove solder dross and automatically scrape off the residue (such as solder balls or solder dross) on the lower arc surface 325 of the pin 320.

[0023] It should be understood that since the scraping part 160 of the first plunger 120 of the telescopic probe device 11 is located on the inclined surface 150, when the scraping part 160 of the telescopic probe device 11 scrapes the residue (such as solder ball or solder dross) on the lower arc surface 325 of the corresponding pin 320, the residue (such as solder ball or solder dross) can be removed from the inclined surface 150 of the telescopic probe device 11.

[0024] In this embodiment, the telescopic probe device 11 is, for example, a coaxial telescopic probe (pogo pin); however, the present invention is not limited thereto. The aforementioned electronic component 300 is, for example, a quad flat package (QFP), a low profile quad flat package (LQFP), an analog-to-digital converter (ADC), and a digital-to-analog converter (DAC), etc.; however, the present invention is not limited thereto.

[0025] Thus, through the above architecture, the telescopic probe device of the test apparatus of the present invention can slide and scrape the arc surface under the corresponding pin of the electronic component during each test, providing a self-cleaning function (i.e., automatically removing solder dross), thereby reducing the resistance value of the probe, improving the conductivity efficiency of the probe and the test results of the probe card.

[0026] Finally, the above-described embodiments are not intended to limit the present invention. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention, and all such modifications and refinements are protected under the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims. [Simplified Explanation of the Diagram]

[0027] To make the above and other objects, features, advantages and embodiments of the present invention more apparent and understandable, the accompanying drawings are described as follows: Figure 1A is a perspective view of a telescopic probe device according to an embodiment of the present invention. Figure 1B is a longitudinal sectional view of the telescopic probe device in Figure 1A along the vertical direction. Figure 2 is a regional schematic diagram of Figure 1A. Figure 3 is a sectional view of Figure 2 along line segment AA. Figure 4 is a partial sectional view of a first plunger according to an embodiment of the present invention, the sectional direction of which is the same as that of Figure 3. Figure 5 is an exploded view of a testing device according to an embodiment of the present invention. Figure 6 is an operational diagram of the telescopic probe device in Figure 5 for use with the pins of electronic components. [Biomaterial Storage]

[0029] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. A telescopic probe device, comprising: a needle body having a cylindrical channel; a compression spring housed within the cylindrical channel; and a first plunger comprising: a column slidably inserted at one end of the needle body and abutting against the compression spring within the cylindrical channel; a needle tip located at the end of the column opposite to the compression spring; an inclined surface connecting the needle tip and the outer surface of the column, the inclined surface having an upper inclined area and a lower inclined area; and a scraping portion located between the upper inclined area and the lower inclined area, comprising a plurality of parallel rows of serrations arranged on the inclined surface, each of the serrations being arranged along the long axis of the inclined surface, wherein the upper inclined area connects the serrations and the needle tip, and the lower inclined area connects the serrations and the outer surface of the column.

2. The telescopic probe device as claimed in claim 1, wherein each of the serrations comprises a plurality of sharp teeth arranged in a single row along the long axis of the inclined surface.

3. The telescopic probe device as claimed in claim 2, wherein the pointed teeth are directly connected to each other or spaced apart along the long axis of the inclined surface.

4. The telescopic probe device as claimed in claim 2, wherein each of the serrations is stepped, and each of the pointed teeth includes a first step surface and a second step surface, the first step surface and the second step surface being orthogonal to each other and parallel to the long axis of the needle body.

5. The telescopic probe device as claimed in claim 1, wherein the number of the serrations is 2 to 3, and a row of solder channels is separated between any two adjacent serrations.

6. The telescopic probe device as claimed in claim 1, wherein the rows of serrations are respectively connected to two opposing outer surfaces of the column.

7. The telescopic probe device as claimed in claim 1, wherein the column further has a two-groove structure, the grooves being formed on two opposing outer surfaces of the column.

8. The telescopic probe device as claimed in claim 1, wherein the long axis of the inclined surface has an angle with the long axis of the needle body, the angle being 135° to 145°.

9. The telescopic probe device as claimed in claim 1 further comprises: a second plunger slidably inserted at the other end of the needle body and abutting against the compression spring within the cylindrical channel.

10. A testing apparatus comprising: a pressing member movable vertically; a circuit board located below the pressing member and including at least one electrical contact; a probe holder including a body and a slot, the body being placed on the circuit board, the slot being recessed in the top surface of the body for placing an electronic component, wherein the electronic component includes a package and at least one pin, the pin including a front portion, a rear portion and a connecting portion, the front portion extending from one side of the package and at a different height from the rear portion, the connecting portion connecting the front portion and the rear portion and forming a lower arc surface with the rear portion; and a telescopic probe device as described in any one of claims 1 to 9, inserted into the bottom of the slot, electrically connected to the electrical contact, and disposed on the lower arc surface perpendicularly aligned with the pin of the electronic component. When the pressing member presses against the electronic component in the slot, the scraping part of the telescopic probe device presses against and slides through the lower arc surface of the pin.

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