Probe system, probe card and probe head for testing electronic device under test integrated on a semiconductor wafer

Abstract

A probe system, a probe card, and a probe head are described herein. The probe head includes a plurality of probes, an upper guide plate unit, and a lower guide plate unit. Each probe comprises a probe tip, a probe tail, and a probe body. The probe tip is configured to contact an electronic device under test. The probe body extends along a longitudinal axis between the probe tail and the probe tip. In each probe, the probe body has a multilayer structure comprising a plurality of probe arms and at least one slit. The probe arms are arranged in a widthwise direction and separated by the at least one slit, and the at least one slit penetrates the probe body in a thickness direction. The plurality of probe arms converge at an upper key portion and a lower key portion, the upper and lower key portions respectively corresponding to guide holes of the upper and lower guide plate units for accommodating the vertical contact probe, and at least one of the upper and lower key portions is located within its corresponding guide hole.

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