Optically accessible circuit package having backside fiber attachment

Abstract

A circuit package includes a photonic integrated circuit (PIC) and four electronic integrated circuits (EIC) electrically connected to and physically overlapping a first surface of the PIC. An optical interface for coupling optical signals into and / or out of the PIC is coupled to a substrate that is attached to a second surface of the PIC opposite the first surface of the PIC. Each EIC includes an analog-mixed signal (AMS) block located at or near a geometric center of the respective EIC. The PIC includes four active regions located at respective corners of the PIC. Each active region of the PIC is coupled to the respective AMS block.

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