Package structure
TW202634307APending Publication Date: 2026-08-16ADVANCED SEMICON ENG INC
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Patent Information
- Application Number
- TW115102955
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-14
- Filing Date
- 2026-01-26
- Publication Date
- 2026-08-16
Smart Images
Figure TWG2TA001073411_001 
Figure TWG2TA001073411_002 
Figure TWG2TA001073411_003
Abstract
A package structure is provided. The package structure includes a photonic carrier, a circuit structure, and an optical transmission structure. The circuit structure includes a plurality of electronic components. The optical transmission structure separates the circuit structure from the photonic carrier and is configured to optically communicate between the electronic components. The photonic carrier is configured to support the circuit structure and the optical transmission structure and is configured to dissipate heat from the electronic components.
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