High bandwidth density optical interfaces for co-packaged devices including photonic integrated circuits
TW202634317APending Publication Date: 2026-08-16APPLIED MATERIALS INC
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Patent Information
- Application Number
- TW114140839
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-05-15
- Filing Date
- 2025-10-22
- Publication Date
- 2026-08-16
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Abstract
An optical interface includes a cladding layer having a plurality of inner cores and a plurality of turning elements formed therein. Each inner core the plurality of inner cores is associated with a respective turning element of the plurality of turning elements. The optical interface further includes an array of optical elements formed on the cladding layer. Each optical element of the array of optical elements is associated with a respective turning element of the plurality of turning elements.
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