Patterning structure and method of making the same, method of depositing underlayers and substrate processing apparatus
TW202634350APending Publication Date: 2026-08-16LAM RES CORP
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Patent Information
- Application Number
- TW115100380
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2020-01-15
- Filing Date
- 2021-01-14
- Publication Date
- 2026-08-16
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Abstract
This disclosure relates generally to a patterning structure including an underlayer and an imaging layer, as well as methods and apparatuses thereof. In particular embodiments, the underlayer provides an increase in radiation absorptivity and / or patterning performance of the imaging layer.
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