Improved sample damage avoidance in devices and methods for sample processing and sample repair

TW202634357APending Publication Date: 2026-08-16CARL ZEISS SMT GMBH
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Patent Information

Application Number
TW114142894
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-05
Filing Date
2025-11-04
Publication Date
2026-08-16

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Abstract

A method for potential determination pertaining to a sample comprises: positioning a probe above the sample; applying at least a first and a second DC voltage offset each from a first range; applying an AC voltage to the probe for the purpose of inducing a mechanical oscillation of the probe; determining a first induced deflection of the probe for the first DC voltage offset and a second induced deflection of the probe for the second DC voltage offset; and determining a potential outside an interval spanned by the first and second DC voltage offsets at least partly on the basis of the first and second deflections. A method for causing approach by a probe towards a sample comprises: causing approach by the probe towards the sample; repeatedly determining a deflection of the probe during the process of causing approach; and ascertaining an approach termination condition for avoiding sample damage at least partly on the basis of the deflection of the probe or the oscillation frequency thereof.
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