Method and system for die to wafer bonding

Abstract

This disclosure provides methods and systems of processing a semiconductor wafer. One method includes obtaining wafer characterization metrology information of a wafer, the wafer including a plurality of dies, and generating a plurality of predicted die shapes based on the wafer characterization metrology information being input into a computing model. Each of the plurality of predicated die shapes corresponds to one of the plurality of dies of the wafer. The method further includes processing the wafer to obtain the plurality of dies and processing the plurality of dies based on the plurality of predicated die shapes.

Images