Substrate processing method and substrate processing apparatus

Abstract

The substrate processing method of the present invention can perform peripheral exposure in conjunction with the outer edge state of the lower film. One embodiment of the substrate processing method of the present invention includes the following steps: generating edge information representing the relationship between a circumferential position around the center of the substrate and the outer edge position of the first film in the radial direction of the substrate, based on an image obtained by photographing a peripheral region of the surface of a substrate on which a first film has been formed; setting an exposure distribution map representing the relationship between the circumferential position and a set value of the exposure width in the radial direction based on the edge information; forming a second film in at least the peripheral region of the surface after obtaining the image; obtaining warpage information of the substrate after forming the second film; setting the relationship between the circumferential position and the exposure position information of the substrate in the exposure distribution map based on the warpage information; and exposing the second film in the peripheral region according to the exposure distribution map.

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