Method and apparatus for correcting processes related to bonded substrates

TW202634371APending Publication Date: 2026-08-16ASML NETHERLANDS BV
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Patent Information

Application Number
TW114147004
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-07-24
Filing Date
2025-12-02
Publication Date
2026-08-16

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Patent Text Reader

Abstract

A method that comprises determining a dynamic common grid based on a location of structures at a bonding interface of a bonded substrate and / or obtaining target substrate distortion data associated with a second substrate that is to be bonded to a first substrate to obtain the bonded substrate. The dynamic common grid and / or target substrate distortion data is used in determining at least a first control action for exposing the first substrate, wherein the control action balances at least first substrate overlay and bonding overlay.
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