conductive adhesive

Abstract

The objective of this invention is to provide a conductive paste with excellent conductivity, heat resistance, and long-term reliability. The conductive paste comprises metal particles, epoxy resin, a hardener, and a flux. The metal particles comprise: a first metal particle containing a high-melting-point metal with a melting point of 800°C or higher; and a second metal particle containing a low-melting-point metal with a melting point of 180°C or lower. The low-melting-point metal is a Sn-Bi alloy, wherein the Sn / Bi mass ratio of the Sn to Bi in the Sn-Bi alloy is 1 or more and 5 or less.