Methods and systems for arc suppression during semiconductor fabrication processes

TW202634657APending Publication Date: 2026-08-16APPLIED MATERIALS INC
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Patent Information

Application Number
TW114138559
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-14
Filing Date
2025-10-07
Publication Date
2026-08-16

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Abstract

The techniques described herein relate to suppresion of arcs during plasma-based semiconductor processes. The techniques can include delivering radio-frequency (RF) power a plasma in a semiconductor processing chamber. The techniques can include detecting a first indication of a first arc event in the semiconductor processing chamber. In response to detecting the first indication of the first arc event, causing the RF power to the plasma to pulse. Causing the RF power to the plasma to pulse can include repeatedly causing the RF power to pulse on and off to suppress the first arc event.
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