Substrate processing device
TW202634658APending Publication Date: 2026-08-16TOKYO ELECTRON LTD
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Patent Information
- Application Number
- TW114139318
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-10-07
- Filing Date
- 2025-10-13
- Publication Date
- 2026-08-16
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Abstract
The substrate processing apparatus includes: a cylindrical first chamber; a first member disposed inside the first chamber; and two or more lifting mechanisms for raising and lowering the first member. The lifting mechanism is configured to include: a second member connected to the first member; a third member rotatably connected to the second member; and a guide bearing mechanism rotatably connected to the third member and driving the third member in the raising and lowering direction of the first member.
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