Methods for preventing arc discharge in the lower electrode assembly and plasma treatment equipment

TW202634661APending Publication Date: 2026-08-16ADVANCED MICRO FAB EQUIP INC CHINA
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Patent Information

Application Number
TW114140421
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-04
Filing Date
2025-10-20
Publication Date
2026-08-16

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Abstract

This invention provides a method and plasma processing equipment for preventing arc discharge in a lower electrode assembly. The method includes: measuring the DC self-bias voltage of a substrate to obtain a corresponding self-bias voltage measurement value; calculating a self-bias voltage compensation value based on the self-bias voltage measurement value; and applying a first DC voltage to the lower electrode assembly, wherein the voltage value of the first DC voltage is the self-bias voltage compensation value, thereby ensuring that the voltage difference between the lower electrode assembly and the substrate is less than a preset first threshold. Its advantages are: by applying a first DC voltage equal to the self-bias voltage compensation value to the lower electrode assembly, the voltage difference between the substrate and the lower electrode assembly is effectively reduced, significantly lowering the probability of arc discharge in the lower electrode assembly during high aspect ratio etching and improving the safety of substrate processing.
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