Semiconductor processing equipment and control methods

TW202634665APending Publication Date: 2026-08-16ADVANCED MICRO FAB EQUIP INC CHINA
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Patent Information

Application Number
TW114151677
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-10
Filing Date
2025-12-29
Publication Date
2026-08-16

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    Figure TWG2TA001073327_003
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Abstract

This invention discloses a semiconductor processing equipment and its control method. The semiconductor processing equipment includes a power supply, an impedance matching device, and a semiconductor processing module. At least one current / voltage sensor is provided between the power supply and the impedance matching device, and the real-time sampling signal of the current / voltage sensor is synchronized with the power signal output by the power supply in real time. At least one operating status sensing and acquisition device is provided between the impedance matching device and the semiconductor processing module, and the operating status sensing and acquisition device acquires the state quantity of the semiconductor processing module in real time. The system also includes a control system, which determines whether the impedance is matched based on the real-time sampling signal and state quantity of the current / voltage sensor, performs root cause analysis when there is an impedance mismatch, and selectively adjusts the operating status of the impedance matching device and / or the semiconductor processing module based on the result of the root cause analysis to eliminate abnormal operating status of the semiconductor processing module and / or achieve impedance matching.
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