Edge ring assembly, lower electrode assembly, plasma treatment apparatus and preparation method

Abstract

This invention discloses an edge ring assembly, a lower electrode assembly, a plasma processing apparatus, and a fabrication method. The edge ring assembly includes: a ring body; a first electrode disposed inside the ring body; and a second electrode disposed inside the ring body, located below and electrically connected to the first electrode. The second electrode is also connected to an external first power source, and there are at least two electrical connection points between the first electrode and the second electrode. Its advantages are: the edge ring assembly improves the uniformity of the radio frequency power distribution on the first electrode through the circumferentially distributed second electrode, thereby creating a more uniform electric field environment on the first electrode. This helps improve the uniformity of the power voltage coupled by the focusing ring, and further enhances the uniformity of the sheath thickness above the focusing ring, ensuring the uniformity of wafer processing.

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