Microelectromechanical system microphone

Abstract

A microelectromechanical system (MEMS) microphone includes: a substrate including a first cavity; a dielectric layer disposed on the substrate, having a first side connected to the substrate and a second side opposite to the first side, wherein the dielectric layer has a second cavity corresponding to the first cavity; a diaphragm located within the second cavity, including a bonding region, a sensing region, and an elastic structure, wherein the bonding region is connected to the dielectric layer, the sensing region includes a peripheral region and a central region, the peripheral region is connected to the central region by the elastic structure, and the elastic structure has a first gap on the side near the central region; a first backplate disposed on the dielectric layer and located on the second side of the dielectric layer; and a protrusion structure located on the first side of the diaphragm opposite to the first cavity. The diaphragm has a first region, the first region being the projection of the opening of the first cavity on the diaphragm on the opposite side of the diaphragm. A first portion of the protrusion structure is located radially between the first gap and the first region of the diaphragm.

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