Wiring board
TW202634875APending Publication Date: 2026-08-16KYOCERA CORP
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Patent Information
- Application Number
- TW114141156
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-24
- Filing Date
- 2025-10-23
- Publication Date
- 2026-08-16
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Abstract
The wiring substrate of the present invention comprises an insulating substrate and a conductor layer. The insulating substrate system is formed by laminating and integrally forming a plurality of ceramic insulating layers. An inorganic interlayer film is provided at the periphery of the insulating substrate and between two adjacent ceramic insulating layers in the lamination direction. The insulating substrate has a recess extending from a side surface of the insulating substrate to at least one surface.
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