Circuit board structure and manufacturing method thereof
TW202634876APending Publication Date: 2026-08-16NAN YA PRINTED CIRCUIT BOARD CORPORATION
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Patent Information
- Application Number
- TW114104292
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-02-06
- Publication Date
- 2026-08-16
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Abstract
A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a substrate, an electronic element, a filling layer, and a first dielectric layer. The substrate has a through hole. The electronic element is embedded in the through hole. The filling layer fills the through hole and covers the electronic element, wherein a surface of the filling layer has one or more cavities. The first dielectric layer is disposed over the filling layer and fills the cavity.
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