laminated body

Abstract

The objective of this invention is to provide a laminate that improves the adhesion between a dielectric layer and an insulating resin layer, thereby enabling the creation of a capacitor-embedded printed circuit board (PCB) for high-frequency signals. This laminate consists of a copper layer and an insulating resin layer sequentially disposed on both sides of a dielectric layer. One or both copper layers are partially removed to accommodate a circuit pattern, thereby allowing a portion of the dielectric layer surface to directly contact the insulating resin layer. The copper layer with the circuit pattern exhibits a peak shape index Sdq×Spc of 10 mm⁻¹ to 5980 mm⁻¹ on the surface in contact with the dielectric layer. Sdq×Spc is the product of the root mean square slope Sdq (measured according to ISO 25178) and the arithmetic mean curvature Spc (measured according to ISO 25178). The insulating resin layer exhibits a dielectric loss tangent Df of 0.0025 or less at 10 GHz.

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